23R0414 - IBM 3.5-inch Hot Swap Filler (LFF) for X3550

Here are 12 technical specifications for the IBM 3.5-inch Hot Swap Filler (LFF) for X3550:

1. Compatibility: IBM System x3550
2. Form factor: 3.5-inch
3. Hot-swap support: Yes
4. Material: Plastic
5. Dimensions (WxDxH): 4.5 cm x 14.5 cm x 2.5 cm
6. Weight: 0.02 kg
7. Color: Black
8. Quantity: 1
9. RoHS compliance: Yes
10. Operating temperature: 10°C to 35°C
11. Storage temperature: -40°C to 60°C
12. Operating humidity: 8% to 80% RH

Helpful notes:
1. This filler is used to fill empty hot-swap bays in the IBM System x3550 server.
2. It is made of lightweight plastic and is easy to install.
3. RoHS compliance ensures that this filler is environmentally friendly.