31R3311 - IBM BladeCenter H IO Module Bay Filler

Technical Specifications:
1. Dimensions: 3.4 x 1.1 x 10.8 inches
2. Weight: 0.32 ounces
3. Material: Plastic
4. Color: Black
5. Compatibility: IBM BladeCenter H
6. Number of bays: 2
7. Hot-swappable: Yes
8. Rack-mountable: Yes
9. Power consumption: N/A
10. Data transfer rate: N/A
11. Operating temperature: 10°C to 35°C
12. Storage temperature: -40°C to 70°C

Helpful Notes:
1. The module bay filler is used to cover empty bays in the BladeCenter H chassis, providing a neat and tidy appearance.
2. This module bay filler is easy to install and remove, making it convenient for maintenance and upgrades.
3. It is important to ensure that the module bay filler is compatible with the BladeCenter H chassis before purchasing.