39M0586 - IBM Processor Heatsink and Retention Module Kit for ThinkCentre

Here are the technical specs for the IBM Processor Heatsink and Retention Module Kit for ThinkCentre:

- Compatibility: IBM ThinkCentre desktops
- Dimensions: 4.4 x 3.8 x 2.8 inches
- Weight: 8.8 ounces
- Material: Aluminum heatsink, plastic retention module
- Fan: None
- Thermal conductivity: 0.22 W/m-K
- Max TDP: 65W

Helpful notes:
1. This kit is designed to keep your processor cool and prevent overheating.
2. It is important to ensure compatibility with your specific ThinkCentre model before purchasing.
3. This kit does not include a fan, so you may need to purchase one separately if your processor requires active cooling.