408316-502 - HP BLC7000 Enclosure Chassis

1. Dimensions: 17.5 x 32.8 x 10.4 in (44.45 x 83.31 x 26.42 cm)
2. Weight: 120 lbs (54.4 kg) (fully loaded)
3. Power supply: 6 hot-plug power supplies, each with 2250W capacity
4. Cooling: 10 hot-plug fan modules for N+1 redundancy
5. Management: Onboard Administrator module for enclosure management
6. Capacity: Up to 16 half-height server blades or 8 full-height server blades
7. Networking: 8 interconnect bays for Ethernet, Fibre Channel, InfiniBand, or other interconnect technologies
8. Compatibility: Supports HP ProLiant, Integrity, and BladeSystem server blades
9. Expansion: Up to 8 enclosures can be stacked and managed as a single entity
10. Security: Enclosure bay identification and status LEDs for easy tracking and troubleshooting
11. Operating temperature: 50°F to 95°F (10°C to 35°C)
12. Humidity: 10% to 90% relative humidity (non-condensing)

Notes:
1. The BLC7000 Enclosure Chassis is a highly scalable and flexible solution for data center environments.
2. With its advanced management capabilities, it simplifies the deployment and management of server blades.
3. The enclosure's modular design allows for easy upgrades and maintenance, reducing downtime and increasing productivity.