BXSTS100C - Intel Thermal Solution Active/Passive Combo Heat up to 130-Watts CPU TDP Socket LGA1366

Technical Specs:
- Compatible Socket: LGA1366
- Maximum CPU Thermal Design Power (TDP) supported: 130 Watts
- Heat Sink Material: Copper Base and Aluminum Fins
- Fan Dimensions: 80mm x 80mm x 25mm
- Fan Speed: 1200 - 2800 RPM
- Noise Level: 22 - 38 dBA
- Voltage: 12V DC
- Dimensions: 90mm x 90mm x 64mm

Helpful Notes:
1. This combo heat sink/fan solution is designed to cool CPUs with a maximum TDP of 130 Watts.
2. The fan speed can be adjusted to balance noise level and cooling performance.
3. The copper base ensures efficient heat transfer from the CPU to the heat sink.